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The China Intellectual Property & Innovation Summit (CIPIS) 2016

Conways Asia is going to organize the China Intellectual Property & Innovation Summit (CIPIS) 2016.

Date: 27th - 28th October, 2016
Venue: Shenzhen, China

About the CIPIS Summit:
CIPIS summits locate globally, connect at home & abroad and discuss hot practical topics within 2 days. More than 400 IP heads from industries like telecommunication, electronics, software, pharmaceutical, Internet, etc. will gather for the superb opportunity for conversation, collaboration, and networking.

Key topics to be discussed in 2016:

  • The Latest Judicial Interpretation on Intellectual Property
  • Patent Litigation Dispute Resolution
  • Patent Litigation Strategies after AIA Revision
  • Digging Deeper: Apple's Paying Patent Royalties to Huawei; Discussion on the Patent Portfolio in Telecoms Industry
  • The Unitary Patent and UPC: State of Play
  • GUI Patent Protection and Infringement Deciding
  • IP Strategy in the Process of Drug R & D
  • Patent Environment Dialectical relationship between Patent Quality and Patent Operation
  • How to Conduct Scientific and Technological Innovation and Technology Transfer, Maximize the Patent Value
  • Developments in Standard Essential Patents and FRAND Licensing
  • Internet + Intellectual Property and Industry Development
  • Online and Offline Tort: Do they differ?

Who should attend?

  • The Latest Judicial Interpretation on Intellectual Property
  • Chief / General IP Counsel
  • VP & Director of IP Strategy
  • IP Owner / Investor
  • Head of IP Litigation
  • R & D Director
  • Director / VP of Licensing
  • IP Partner / Attorney
  • IP Agent

Online Registration:
http://www.intellectualpropertysummit.com/conwaysasia/cipis2016-SZ/Register.html

Contact:
Ms. Cheung
Phone: +86-21-31595775

The China Intellectual Property & Innovation Summit (CIPIS) 2016
Phone: +86-21-67658679
Fax: +86-21-67658679
Email: cipis@conwaysasia.com
Website: http://www.intellectualpropertysummit.com/conwaysasia/cipis2016-SZ/index.html

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